TESTING ITEMS

TESTING ITEMS

X-ray Examination
X-ray examination is currently a fast and effective method for analyzing the internal structure or defects of products using non-destructive samples. X-rays are produced by high-voltage bombardment of target materials. As X-rays pass through substances of differing densities, their intensity changes variably to form contrast images, which are used to check the internal structure of electronic components and semiconductor packages, plus the soldering quality of all SMT solder joints.

Standard

《SAE AS6081 2012》
《IDEA-STD-1010B》
《GJB 548C-2021》
Customers provide or suggest using standards

Workflow

Sample preparation ⇒ Capture the coordinates of the test object ⇒ Set testing conditions ⇒ Start testing ⇒ Adjust images ⇒ Observe and record ⇒ Evaluate results

Key points of detection requirements

X-ray examination mainly checks the internal wafers, bonding wires, frames, and bonding materials of chips. It can also detect various abnormal phenomena such as wafer cracks, bonding material voids, bonding material climbing height, bonding wire integrity, and welding, ESD damage, etc. At the same time, it can be compared with Golden Sample to confirm the consistency of the internal structure of the chip.

Key testing requirements: wafer, frame, bonding wire, consistency

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