A rating indicating a component's susceptibility to damage due to absorbed moisture when subjected to reflow soldering.
Moisture Sensitivity Level (MSL): A rating indicating the degree to which a component is susceptible to damage during reflow soldering due to moisture absorption.
Dry pack consists of desiccant material and a Humidity Indicator Card(HIC) sealed with Surface Mount Device(SMD) packages inside a moisture barrier bag(MBB)
Dry packaging: Dry packaging consists of dry materials and humidity indicator cards (HIC), sealed together with surface mount device (SMD) packaging in a moisture-proof bag (MBB).
The rapid transfer of electrostatic charge between surfaces of objects at different electrostatic potentials.
Electrostatic Discharge The rapid transfer of electrostatic charges between surfaces of objects with different electrostatic potentials.
Materials with a surface or volume resistivity greater than or equal to 1×10^4 ohms but less than 1×10^11 ohms.
Static dissipative materials: Materials with surface resistance or volume resistance greater than or equal to 1 × 10 ^ 4 ohms but less than 1 × 10 ^ 11 ohms.
The manner in which electronic components are packaged in preparation for use by electronic assemblers.The four most common types of packaging include bulk,tape and reel,trays,and tubes.
Packaging (components) Electronic components are packaged for use by electronic assemblers. The four most common types of packaging include bulk, roll, pallet, and tube packaging.
The type of physical configuration an electronic component.Common packages include: SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA, etc.
Device packaging: The types of physical configurations of electronic components. Common packaging includes SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA, etc
A visual representation,such as a dimple,notch,or laser or ink marking,that is used to indicate the number one lead(pin) on the component
Pin 1 indicator: Visual identification used to indicate the pin (lead) numbered 1 on the component, such as dents, notches, laser or ink marks.
Any part,documentation,packageing,labeling,or identifying information that has been modified so as to fraudulently misrepresent authenticity.
Counterfeit products: Any product that has been tampered with in its components, documents, packaging, labeling, or identification information, resulting in fraudulent false claims of authenticity.
A part or device that is soldered directly to the surface of a PC board
Surface mount devices (SMD) A component or device that is directly soldered onto the surface of a printed circuit board (PCB).
Product that has been externally reconditioned or restored to appear to a like new condition.
Renovation: After external refurbishment or repair, the appearance of the product looks like new.
A metal structure to which a die is attached. Wire bonds then connect the die to the leads. This is then encapsulated, usually in plastic but can be metal or ceramic, to cover and complete the device.
Lead frame: A metal structure with grains attached to it, connected to leads through bonding wires. It is usually packaged with plastic, but metal or ceramic materials can also be used to cover and complete the device manufacturing.
A disc；with respect to electronic components,a wafer is a highly polished disc of silicon or some other semicondutor material that is then used as the foundation upon which an integrated circuit or other semiconductor devices is built.
Wafer: In the field of electronic components, a wafer refers to a disc made of highly polished silicon or other semiconductor materials. It serves as the foundation for the construction of integrated circuits or other semiconductor devices.
A small,square or rectangular piece of semiconductor material,usually silicon,onto which a complete integrated circuit is etched.The die is internal and encapsulated in the package.
Grain size: A small, square or rectangular semiconductor material, usually made of silicon, with a complete integrated circuit etched on it. The internal structure enclosed in a package.
Very fine wires used to attach the semiconductor die to the leadframe for the purpose of making electrical connections.
Bonding wire: A very thin wire used to connect semiconductor chips to lead frames for electrical connection.
Analysis of a device that does not involve destruction of any part of the device.
Non destructive analysis: A method of analysis that does not cause damage to any part of the sample.
A systematic, logical, detailed examination of parts during various stages of physical disassembly,conducted on a sample of completed parts from a given lot, wherein parts are examined for a wide variety of design, workmanship,and/or processing problems.
Destructive Physical Analysis (DPA) A systematic, logical, and detailed inspection method that conducts a comprehensive inspection of components at various stages of physical disassembly for finished product samples extracted from a specific batch, in order to identify various problems in design, process, and/or manufacturing processes.