TESTING ITEMS

TESTING ITEMS

Decapsulation
Decapsulation is a destructive testing method that uses laser etching and chemical reagents to corrode the external packaging shell of the chip, exposing the internal structure of the chip and facilitating direct observation of the original factory identification, layout, process defects, etc. on the surface of the internal wafer. Open lid testing is a major means of authenticity detection and can also provide intuitive detection and judgment for failure analysis.

Standard

《SAE AS6081 2012》
《IDEA-STD-1010B》
《GJB 548C-2021》
Customers provide or suggest using standards

Workflow

Confirm sample type ⇒ Laser etching ⇒ Acid reagent corrosion ⇒ Surface cleaning ⇒ Observation record ⇒ Result evaluation

Key points of detection requirements

After opening the cover, the chip can be clearly observed for the surface condition of the wafer, whether there are any broken edges or cracks, whether there are any abnormalities on the surface, whether the wafer logo and size meet the specifications and standards, and thus determine the authenticity and defects of the chip.

Key testing requirements: wafer, bonding wire

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