Shenzhen Ansheng Testing Technology Co., Ltd

TESTING ITEMS

Solderability Testing

Solderability testing is generally used to qualitatively and quantitatively evaluate the solderability of electronic components. In the assembly and welding process of electronic products, the welding quality directly affects the overall quality of the machine. Therefore, in order to ensure welding quality, in addition to strictly controlling process parameters, scientific solderability testing of electronic components is also required.

Standard

《J-STD-002E》
《GJB 548C-2021》
Customers provide or suggest using standards

Workflow

Homework preparation ⇒ Welding groove heating ⇒ Adjusting the immersion angle ⇒ Setting the immersion frequency ⇒ Observation record ⇒ Result evaluation

Key points of detection requirements

Testing requirements:
The sample that has completed the solderability test should be observed under a binocular microscope with a magnification of at least 10 times to observe the solder adhesion of the pin solder ends. There should be no cracking, deformation, discoloration, or other phenomena. If the solder adhesion area of the solder ends reaches 95% or more and the solder area on the solder pads reaches 80% or more, it can be judged as qualified.
Key testing requirements: Pin soldering area of over 95%, solder pad soldering area of over 80%