TESTING ITEMS

TESTING ITEMS

Ultrasonic Testing
Ultrasonic testing will undergo phenomena such as reflection, scattering, absorption, and obstruction when encountering contact surfaces of different media. By emitting ultrasonic waves into the chip through an ultrasonic probe, defects, cracks, pores, and other issues inside the chip can be determined based on the reflection and propagation of ultrasonic waves inside the chip

Standard

《IPC/JEDEC J-STD-020》
《IPC/JEDEC J-STD-035》
Customers provide or suggest using standards

Workflow

Sample preparation ⇒ Confirm sample type ⇒ Select frequency probe ⇒ Select scanning mode ⇒ Observation record ⇒ Result evaluation

Key points of detection requirements

Testing requirements:

Ultrasonic microscopy analysis technology, by emitting and receiving ultrasonic signals, can distinguish the differences in internal acoustic impedance of materials, as well as defects such as voids or delamination in various layers of components, through image and acoustic contrast without damaging the chip.

Key inspection requirements: layering, bubbles, defect localization

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