TESTING ITEMS

TESTING ITEMS

Baking Service
By using a high-precision oven, the surface moisture of the components can be effectively removed, avoiding damage to the components in humid environments. The presence of moisture may affect the normal use of components. High temperature baking can dry the surface of components, reduce the risk of components during soldering, and protect the integrity and stability of components.

Standard

《IPC/JEDEC J-STD-033D》
Customers provide or suggest using standards

Workflow

Sample preparation ⇒ Set temperature/time ⇒ Start baking ⇒ Data recording ⇒ End baking ⇒ Packaging vacuum treatment

Key points of detection requirements

Due to the fact that the components are completely exposed during the baking process, it is necessary to do a good job of electrostatic protection to prevent damage to the components due to static electricity; Based on the humidity level (MSL) and packaging thickness of the components to be baked, determine the temperature and time required for baking. Finally, use anti-static and humidity sensitive vacuum bags to vacuum package the fully baked components, and place moisture-proof desiccants and humidity indicator cards inside the packaging.

Key baking requirements: temperature, time, electrostatic protection, vacuum packaging